Our Company

Park Electrochemical Corp. is a global advanced materials company which develops and manufactures advanced composite materials, primary and secondary structures and assemblies and low-volume tooling for the aerospace markets and high-technology digital and RF/microwave printed circuit materials principally for the telecommunications and internet infrastructure, enterprise and military/aerospace markets. The Company’s manufacturing facilities are located in Kansas, Singapore, France, Arizona and California. The Company also maintains R&D facilities in Arizona, Kansas and Singapore.

History

2017
  • Park introduces N4000-6NF high-Tg epoxy prepreg system
  • Park announces Long-Term Purchase Agreement with GE Aviation Subsidiary
  • Park introduces Meteorwave 3350 copper-clad laminate designed specifically for RF applications
  • Park introduces introduction of M-PLY prepreg designed specifically for RF/digital hybrid bonding
  • Park announces consolidation of its U.S. Electronic Materials Business Units

2016
  • Park adopts New OEM Program Agreement Marketing Strategy
  • Park enters into Joint Development Agreement with Major Electronics OEM
  • Park enters into qualification agreement with Major Aerospace Company
  • Park produces composite parts and assemblies and low-volume tooling for Textron’s First Production Conforming Scorpion Jet


Timeline

2017

2015

Park introduces E-752-LT advanced 350 °F cure AFP material for primary and secondary Aerospace structures.
Park introduces Meteorwave 3000 and Meteorwave 4000 additions to the Meteorwave family Electronic Materials.

2014

2014

Park goes into production on program for major jet engine manufacturer.

2013

2013

Park produces composite parts and assemblies and low-volume tooling for Textron’s Scorpion Jet Demo Unit One.

2012

2012

Park introduces new line of advanced high performance electronic materials products: Mercurywave® 9350, N4800-20 & N4800-20 SI®and Meteorwave® 1000 & Meteorwave® 2000.

2011

2011

Park completes the expansion of its Park Aerospace Technologies Corp. (“PATC”) facility in Newton, KS to design and manufacture advanced composite parts and assemblies for the aerospace market. PATC receives a Nadcap Accreditation for Non-Metallic Materials Manufacturing. Nelco Products Pte in Singapore installs additional treating capacity for PTFE materials to provide improved service to the RF and Microwave customers in the Asia Pacific region.

2010

2010

Regular Quarterly Cash Dividend paid every quarter for the last 25 years.

2009

2009

Park breaks ground on the expansion of its new facility in Newton, Kansas to design and manufacture advanced composite parts and assemblies for the aerospace market. Park receives R&D Supplier of the Year Award from Northrop Grumman.

2009

Park opens a new facility in Newton, Kansas to produce advanced composite materials for the North American aerospace market.

2008

2008

Park commissions the Nelco Products Pte. Ltd. “Pioneer” facility in Singapore to produce advanced composite materials for the Asian aerospace market. Park acquires Nova Composites, Inc.

2007

2007

Park broke ground on a new advanced composite factory in Singapore. Park also announced an upcoming composites facility in Kansas.

2005

2005

The Nelco Technology Zhuhai facility is completed.

2004

2004

Park Electrochemical Corp. reaches it’s 50th Anniversary! Park begins constructing a new manufacturing facility in Zhuhai, China.

2003

2003

The Nelco Products, PTE facility undergoes another expansion. R&D expands at Neltec, Inc. in Arizona. Park exits the mass lamination market in Europe. Park and Snecma Propulsion Systems entered into a long-term agreement, in which Park will market and distribute SPS’s Raycarb C2 carbonized rayon fabric to manufacturers of rocket motors for tactical and heavy launch vehicle motors.

2002

2002

Park opens a Nelco® electronics material facility in Wuxi, China to support the Chinese marketplace. The European operations are consolidated with the closure of the Nelco, UK manufacturing facility.

2001

2001

2001
Park completes expansions of its Nelco® electronic material manufacturing facilities in Fullerton, CA and Newburgh, NY, which include automated lamination and finishing technology and advanced treating technology. Neltec, Inc. in Arizona adds capabilities to offer Nelco® RF/Microwave materials in the United States, including materials for long laminate antenna applications. Park sells its Nelco Technology Inc. mass lamination facility in the United States.

2000

2000

Park offers the advanced composite material industry’s first FAA Accepted Design Allowables Database that can be shared by multiple users.

1997

1997

Park acquires Dielektra GmbH, in Cologne, Germany, to expand its ability to provide Nelco® PCB materials in Europe.

1993

1993

Park’s Nelco Products, PTE facility doubles its manufacturing capacity providing additional support for higher technology manufacturing.

1992

1992

1992
Park opened Neltec, Inc., an advanced materials manufacturing and R&D facility, in Tempe, AZ. Park acquired Metclad, later renamed to Neltec S.A., in Lannemezan, France to expand the company’s electronics product lines into the RF/Microwave markets.

1988

1988

Park established FiberCote Industries, Inc., which was renamed Nelcote, Inc. in 2006 and Park Advanced Composite Materials, Inc. in 2008. This business unit manufactured advanced composite materials.

1986

1986

Park constructed its Nelco Products, PTE facility in Singapore to further participate in the globalization of the electronic substrates industry into the Asia Pacific.

1984

1984

1984
Park constructed new manufacturing facilities in Fullerton, CA and Skelmersdale, England to service the company’s growing electronic materials customer base and the printed circuit board industry’s higher technology needs. Park acquired it’s Nelco SA facility in France to further service the European continent. Park pioneered the use of vacuum lamination. The Nelco Technology Inc. semi-finished multilayer facility was constructed in Tempe, AZ.

1971

1971

1971
Park’s Stamford, CT operation moved to a larger location in Walden, NY.

1969

1969

Park opened its Nelco UK electronics materials subsidiary in Skelmersdale, England.

1965

1965

Park Electrochemical Corp. opened it’s second subsidiary, Nelco Products, Inc., in Anaheim, CA.

1962

1962

Park believes it invented the first multilayer printed circuit materials system.

1957

1957

Park believes it founded the modern day printed circuit industry with the invention of an epoxy-glass, copper-clad laminate in Stamford, CT.

1954

1954

Park Electrochemical Corp. was founded by Jerry Shore and Tony Chiesa who are depicted in the photograph above.