Digital Printed Circuit Materials

Superior thermal and mechanical performance

  • All Nelco materials are RoHS compliant
  • Many provide high thermal reliability and CAF resistance for lead-free assembly compatibility
  • Reliable source – 50+ years of global materials experience
  • Many material types available including:
    • FR-4, High-Tg and high speed epoxy materials
    • Advanced materials such as BT, polyimide and cyanate ester

Designed for high layer count PCB and high speed digital applications lead-free assemblies

  • high speed / low loss and fine-line multilayers
  • backplanes
  • communications and networking servers
  • wireless handsets and infrastructure
  • automotive
  • diverse mounting and packaging

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