Contact: Martina Bar Kochva
48 South Service Road
Melville, NY 11747
PARK ELECTROCHEMICAL CORP. ANNOUNCES APPOINTMENT OF
FRANK ALBERTO AS PRESIDENT OF PARK’S ASIAN BUSINESS UNIT
Melville, New York, Friday, January 6, 2017…..Park Electrochemical Corp. (NYSE-PKE) announced the appointment of Frank Alberto, Jr. as President of Nelco Products Pte. Ltd., Park’s Asian Business Unit based in Singapore. Mr. Alberto will report to Chris Mastrogiacomo, Park’s President and Chief Operating Officer. Mr. Alberto is succeeding Ron Brett who retired after having been President of Nelco Products Pte. Ltd. since February 2009.
Mr. Alberto had been Vice President of Quality Engineering of Park Electrochemical Corp. since December 2010, when he joined Park. Prior to joining Park, Mr. Alberto held management positions with Sanmina-SCI Corporation, a leading electronics contract manufacturing services company, and its predecessor, Hadco Corporation, a major manufacturer of advanced electronic interconnect systems. Since 2008, Mr. Alberto was Vice President of Quality of Sanmina-SCI Corporation PCB Operations; during 2008 and 2009, he was Vice President of Engineering and acting General Manager of the Wuxi printed circuit board operations of Sanmina-SCI Corporation; and from 2004 to 2008 he was Vice President of Engineering, Euro-Asia PCB Region of Sanmina-SCI Singapore. During the 23 years prior to 2004, Mr. Alberto held several positions with Sun Microsystems, Sanmina-SCI Corporation, Hadco Corporation and Microfab Incorporated in Amesbury, Massachusetts. Mr. Alberto received a Bachelor of Science degree in Environmental Engineering from Worcester Polytechnic Institute in Worcester, Massachusetts and a Master of Science degree in Manufacturing Engineering from the University of Massachusetts.
Park Electrochemical Corp. is a global advanced materials company which develops and manufactures advanced composite materials, primary and secondary structures and assemblies and low-volume tooling for the aerospace markets and high-technology digital and RF/microwave printed circuit materials principally for the telecommunications and internet infrastructure, enterprise and military/aerospace markets. The Company’s manufacturing facilities are located in Kansas, Singapore, France, Arizona and California. The Company also maintains R&D facilities in Arizona, Kansas and Singapore.