is a global advanced materials company which develops and manufactures high-technology digital and RF/microwave printed circuit materials principally for the telecommunications and internet infrastructure and high-end computing markets and advanced composite materials, parts and assemblies for the aerospace markets. Park's core capabilities are in the areas of polymer chemistry formulation and coating technology. The Company's manufacturing facilities are located in Singapore, France, Kansas, Arizona and California. The Company also maintains R&D facilities in Arizona, Kansas and Singapore.
Materials designed for aircraft primary and secondary structures, interiors and radomes. Broadgoods, unidirectional/ biased tapes, and molding compounds are available.
Lightweight composite parts and assemblies designed to provide unique solutions primarily for general aviation and other aerospace applications.
Advanced electronics materials for reliable, high-performance, multilayer designs. All PCB materials are RoHS compliant. High speed/low loss and lead-free assembly compatible materials are available.
Materials designed for critical microwave components, antennas and subassemblies. Tightly controlled electrical and mechanical properties ensure consistent performance.